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RF4 печатная плата

LEADHUI PCB manufactures single-sided, double-sided, multilayer, high-Tg, heavy-copper, and impedance-controlled FR-4 circuit boards for electronics projects from prototype to production.Диапазон теплопроводности: 1,0–3,0 Вт/м·КПолучить расценки
multilayer pcb

FR-4 PCB Types We Manufacture

single sided fr 4 pcb

Single-Sided FR-4 PCB

Наиболее экономичная и распространенная конфигурация. Состоит из одного медного слоя трассировки, термодиэлектрического слоя и алюминиевой основы. Оптимизирована исключительно для монтажа поверхностного монтажа (SMT).

  • Количество слоев:1-layer rigid FR-4 PCB
  • Идеально подходит для:Simple controls, power modules, basic consumer electronics
  • Уровень затрат:Low
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double sided pcb

Double-Sided FR-4 PCB

Разработана для сложных схем, требующих высокой плотности размещения компонентов. Благодаря встраиванию алюминиевого сердечника или подложки между несколькими слоями FR4, она обеспечивает расширенные возможности трассировки за счет использования специальных изолированных металлизированных сквозных отверстий (PTH).

  • Количество слоев:2-layer plated-through-hole PCB
  • Идеально подходит для:Control boards, LED drivers, instrumentation
  • Уровень затрат:Low–Medium
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multilayer pcb

Multilayer FR-4 PCB

Алюминиевые платы и планки для печатных плат представляют собой длинные узкие печатные платы с металлическим сердечником, предназначенные для линейного освещения и светодиодных модулей. Они обеспечивают стабильный отвод тепла, равномерное размещение светодиодов и гибкий выбор длины для различных световых конструкций.

  • Тип доски:4-layer and above rigid PCB
  • Идеально подходит для:Dense routing, communication, industrial electronics
  • Уровень затрат:Medium–High
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high tg fr 4 pcb

High-Tg FR-4 PCB

High-Tg FR-4 materials are designed for applications that experience higher thermal stress during lead-free assembly or product operation. They can be a good choice for multilayer boards, automotive-related electronics, industrial equipment, and higher-reliability assemblies.

  • Тип доски:High thermal-resistance FR-4 laminate
  • Идеально подходит для:Lead-free assembly, industrial and higher-reliability products
  • Уровень затрат:Medium–High
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What Is an FR-4 PCB?

FR-4 is a flame-retardant glass-reinforced epoxy laminate used as the insulating base material of a rigid printed circuit board. Copper foil is laminated to one or both sides of the FR-4 core, then patterned to form the electrical circuitry.

The material is valued for its:

  • Good electrical insulation and dielectric stability
  • Strong mechanical support for components and connectors
  • Reliable performance in standard electronic applications
  • Compatibility with common PCB fabrication and assembly processes
  • Broad material availability and competitive cost

“FR-4” describes a material family rather than one fixed formulation. LEADHUI PCB can recommend standard, high-Tg, halogen-free, or other suitable FR-4 materials according to your operating temperature, reliability target, layer count, impedance, and assembly requirements.

fr4 core pcb structure

FR-4 PCB Manufacturing Process

1. File Review and Engineering Evaluation

Our team reviews your Gerber files, drill files, layer stack-up, fabrication drawing, and technical requirements. We confirm manufacturability concerns before production begins.

2. Material Preparation and Inner-Layer Imaging

The selected FR-4 laminate and copper foil are prepared. Inner-layer circuitry is imaged, etched, inspected, and prepared for lamination.

3. Multilayer Lamination

For multilayer boards, inner layers are bonded with prepreg under controlled heat and pressure to form the final PCB structure.

4. Drilling and Hole Metallization

Mechanical drilling or laser drilling is performed according to the design. Hole walls are then prepared and plated to establish electrical interconnection between layers.

5. Outer-Layer Circuit Formation

The outer copper layers are patterned to create traces, pads, planes, and other circuit features.

6. Solder Mask, Silkscreen, and Surface Finish

Solder mask is applied to protect exposed circuitry. Silkscreen markings and the selected surface finish are then added to support assembly and long-term solderability.

7. Electrical Test and Final Inspection

Boards are inspected and electrically tested according to the approved production requirements before packing and shipment.

Why Choose FR-4 for Your PCB?

Cost-Effective for Most Rigid PCB Applications/strong>
FR-4 is broadly available and compatible with mainstream PCB processes, helping control material and production costs without sacrificing core performance.

Flexible Design Options
FR-4 can support simple one-layer boards through complex multilayer constructions, making it suitable for product development as well as production scaling.

Compatible With SMT and Through-Hole Assembly
FR-4 boards work well with reflow soldering, wave soldering, selective soldering, and manual assembly processes. They can support SMT, THT, and mixed-technology PCB assembly.

Suitable for Many Industries
FR-4 PCBs are used across consumer electronics, industrial controls, telecom devices, instrumentation, smart home products, LED electronics, power systems, and IoT hardware.

Технические возможности

Пункт FR-4 PCB Capability
Тип печатной платы Rigid FR-4 printed circuit boards.
Количество слоев 1–32 layers, subject to board construction and engineering review.
Board Construction Single-sided, double-sided, multilayer, HDI, and high-density FR-4 PCB designs.
Standard Material Standard FR-4 glass-reinforced epoxy laminate.
Material Options High-Tg FR-4, halogen-free FR-4, high-CTI FR-4, and selected low-loss materials available upon engineering review.
Толщина доски Common board thicknesses from 0.4 mm to 3.2 mm. Custom thicknesses are available based on material availability and stack-up requirements.
Copper Weight 0.5 oz to 6 oz copper for standard designs. Heavy-copper construction is available for higher-current applications upon review.
Minimum Trace / Space Determined by copper thickness, layer count, board structure, and production requirements. Fine-line routing is available for HDI designs.
Минимальный размер отверстия Mechanical drilling and laser drilling are available according to board thickness, aspect ratio, and via design requirements.
Via Types Through vias, blind vias, buried vias, via-in-pad, filled vias, capped vias, and microvias are available upon engineering review.
Surface Finishes HASL, lead-free HASL, ENIG, OSP, immersion tin, immersion silver, hard gold, and other finishes based on project requirements.
Паяльная маска Green, black, white, red, blue, yellow, and custom solder mask colors subject to material availability.
Шелкография White, black, and selected silkscreen color options depending on solder mask contrast and project requirements.
Controlled Impedance Available for high-speed, RF-related, and signal-sensitive designs. Stack-up and impedance targets should be provided for engineering confirmation.
Special Features Gold fingers, edge plating, castellated holes, countersinks, counterbores, panelization, scoring, routing, and special cutouts available upon review.
Электротехнические испытания Electrical testing can be arranged according to the board design, netlist availability, production quantity, and project requirements.
Стандарт качества Manufactured according to applicable IPC requirements and approved production documentation.
Order Volume Supports prototype, NPI, low-volume, and production FR-4 PCB orders.

FR4 PCB FAQ

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