Quality & Testing Capabilities

Gerber review: PCB layers, copper features, drill files, solder mask, silkscreen, and fabrication notes are reviewed before manufacturing.

BOM review: Component part numbers, package types, reference designators, quantities, and component availability are checked before assembly.

CPL review: Pick-and-place coordinates, rotation, board side, polarity, and component placement data are reviewed before SMT production.

DFM check: Potential manufacturability issues are reviewed to reduce production risk before fabrication or assembly.

PCB material inspection: Base materials, copper thickness, board thickness, and material condition are checked before production.

Component inspection: Components are checked according to BOM, packaging, label, quantity, and appearance requirements.

Special material review: Aluminum substrates, LED-related materials, high-power components, and customer-specified materials can be reviewed according to project needs.

Process inspection: Key PCB manufacturing steps are monitored during production to ensure process stability.

Dimension inspection: Board size, hole size, slot size, profile, and tolerance requirements are checked according to drawings.

Surface finish inspection: HASL, lead-free HASL, ENIG, OSP, or other surface finishes are inspected based on project requirements.

Solder mask inspection: Solder mask coverage, opening, color, and surface quality are checked before shipment.

Silkscreen inspection: Reference designators, polarity marks, logos, and printed markings are checked for readability and accuracy.

Open / short test: Bare PCBs can be tested to detect open circuits, short circuits, and connectivity issues.

Flying probe test: Suitable for prototypes and small-batch PCB production.

Fixture test: Suitable for batch production and repeated PCB orders.

Continuity verification: Electrical connectivity is checked before boards are released for shipment or assembly.

First board verification: The first assembled board is checked before continuing batch assembly.

Component placement check: Component values, reference designators, polarity, orientation, and package matching are verified.

Soldering check: Solder joint quality, bridges, missing parts, insufficient solder, and placement accuracy are reviewed.

Solder Paste Inspection: SPI can be used to check solder paste volume, area, height, and alignment before component placement.

AOI inspection: Automated Optical Inspection helps detect missing components, wrong components, misalignment, polarity errors, tombstoning, solder bridges, and insufficient solder.

Visual inspection: QC staff inspect component placement, solder joints, polarity marks, connectors, LEDs, and board appearance.

BGA inspection: X-ray inspection can be used to check hidden solder joints under BGA packages.

QFN / DFN inspection: X-ray inspection can help verify hidden pads, voids, bridges, and solder quality for bottom-terminated components.

Project-based use: X-ray inspection is recommended for complex assemblies with hidden solder joints or high-reliability requirements.

Power-on test: Basic power-up verification can be performed according to customer requirements.

Functional test: PCBAs can be tested according to customer-provided test procedures, fixtures, firmware, or product requirements.

Signal / interface test: Selected interfaces or signal functions can be tested when test methods are provided.

Customer-defined test: Custom test steps can be arranged based on project needs and available test conditions.

IC / MCU programming: Programming can be supported when customers provide firmware files, programming tools, and clear instructions.

Programming verification: Programmed boards can be checked according to customer-defined verification steps.

Firmware confidentiality: Customer files and firmware information are handled according to project communication and confidentiality requirements.

LED polarity inspection: LED orientation and polarity are checked to reduce assembly-related failures.

Lighting test: LED PCBAs can be powered on to verify brightness, polarity, connection, and lighting performance according to customer requirements.

Aluminum PCB inspection: Aluminum PCB appearance, solder mask, surface finish, insulation, and thermal-related requirements are checked according to project needs.

Aging / burn-in test: Aging test can be arranged for LED lighting or power-related products when required [Confirm].

Appearance inspection: Finished PCBs and PCBAs are checked for scratches, contamination, soldering quality, component placement, and surface condition.

Quantity check: Finished products are counted and checked against order requirements.

Label and revision check: Part numbers, revisions, labels, and customer markings can be checked before shipment.

Packaging inspection: Packaging method, ESD protection, carton condition, and shipping labels are checked before delivery.

ESD-safe handling: PCBAs are handled with electrostatic protection during assembly, inspection, and packaging.

ESD packaging: Assembled boards can be packed in ESD-safe bags, trays, or protective materials.

Component protection: Sensitive components are handled according to packaging and storage requirements.

Vacuum packaging: Bare PCBs can be vacuum-packed to help reduce moisture and contamination risk.

Protective packaging: Bubble wrap, foam, trays, cartons, or custom packaging can be used based on board type, component sensitivity, and shipping method.

Export packaging: Packaging can be arranged for international express, air freight, sea freight, or customer-designated logistics providers.

Test reports: Test reports can be provided according to project requirements.

Inspection records: Inspection records can be maintained according to order and quality requirements [Confirm].

Compliance documents: RoHS, material, or other compliance-related documents can be provided when available and required.

If a quality issue is found after delivery, customers can provide order details, photos, test results, and problem descriptions. Our team will review the issue, analyze possible causes, and provide repair, rework, replacement, or technical support according to the confirmed situation.